Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products.
In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.
Description
- You will be responsible for advanced packaging development and pathfinding.
- Drive engagement with leading-edge foundries/OSATs to lead package integration, process definition, and architecture efforts.
- Define specs, drive process windows, and establish advanced packaging solutions (2.5D/3D, hybrid bonding, high-density wafer-level interconnects).
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience.
Preferred Qualifications
MS/PhD and 6+ years of relevant industry experience in advanced wafer-level packaging.
Deep technical expertise in advanced packaging architectures and foundry processes
Hands-on experience reviewing GDS/layout data, physical verification (DRC/LVS), and working with IC layout/viewing tools (e.g., Calibre, Virtuoso, KLayout).
Proven track record managing foundry partners, defining DOEs, driving NPI engineering builds, and analyzing inline/end-of-line metrology and electrical test data.
Solid background in packaging physics, multi-domain interactions (thermo-mechanical, warpage, thin-wafer handling, reliability, and SI/PI fundamentals).
Strong problem-solving, analytical rigor, and communication skills to interface effectively with cross-functional and overseas foundry/OSAT partners.
