Company Description
As the Principal Firmware Architect for UALink Switch Products, you will serve as the technical visionary responsible for defining, designing, and driving the end-to-end embedded software and firmware architecture for our next-generation AI cluster scale-up switches.
In this high-impact role, you will bridge the gap between cutting-edge silicon (ASICs) and upper-layer cluster orchestration software. You will define how firmware manages complex scale-up topologies, ensures raw hardware performance (maximizing bandwidth and minimizing latency), and maintains absolute reliability across thousands of connected AI accelerators.
Job Description
1. Architectural Definition & Design
Hardware-Software Co-Design: Collaborate heavily with ASIC design, logic design (RTL), and verification teams to define hardware-software interfaces, registers, scratchpads, and memory maps.
Protocol Implementation: Define the firmware stack to support UALink physical, link, and transport layers, managing credits, routing tables, and flow control.
2. Initialization, Boot, & Fabric Management
3. Performance, RAS, & Security
Advanced RAS (Reliability, Availability, Serviceability): Design robust error-handling, telemetry, and fault-isolation micro-architectures (e.g., link degradation fallback, FEC, and error containment).
Qualifications
Education & Experience
Degree: Bachelor’s or Master’s/Ph.D. in Computer Engineering, Electrical Engineering, Computer Science, or a related discipline.
Technical Skill Set
Language Masteries: Expert-level proficiency in C for bare-metal and RTOS environments (e.g., ThreadX, FreeRTOS, Zephyr) and Python for hardware automation and modeling.
Protocol Expertise: Deep technical understanding of high-speed scale-up/scale-out interconnect protocols (UALink, NVLink, CXL, or PCIe Gen5/Gen6).
Network Switching Concepts: Comprehensive knowledge of credit-based flow control, packet routing, physical layer (PHY) equalization, and SerDes management.
Additional Information
The expected annual pay range for this position is $230,000-$270,000K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Employment Type: Regular (PERM)Remote Work Available: No
